Higher Board Quality
+Sodium Silicate
The NEW patented combination with Fusion enable the reintroduction of water glass (Sodium Silicate) to improve bonding and board quality ECT values.
Due to its specific combination with Fusion, the Sodium Silicate doesn’t stick to glue units, enabling fast, safe & easy cleaning of the equipment and offering higher board quality.
The presence of the Fusion in a starch of flour adhesive allows to add a Sodium Silicate, and hence enjoy an improved adhesive bond, without suffering the drawbacks associated with a silicate, i.e. the brittleness of the adhesive bond over the long term, and of the residue forming on the processing equipment, and this in particular with the formation of adhesive bonds with paper and/or cardboard as a substrate.
Lower Energy Consumption
Less is more!
Fusion Formulations generate high shear-thinning properties. Excellent balance of tack, water retention, gelling point and thixotrophy enables a short adhesive structure (zero splashing) very thin glue lines just at the top of the fluting.
Less adhesive is less moisture in the fibres resulting in higher production speed with lower temperature settings.
